HPE Xeon Intel -Gold 5318N (2,1 GHz/24 Kerne/150 W) Prozessor für
- Marke: HPE
- Kategorie:
- Lagerhaltungsnummer: P37605-B21
- EAN: 0190017518688
Intel Xeon-Gold 5318N (2,1 GHz/24 Kerne/150 W) Prozessor für HPE
Offer details
Handelspreise
| Vertriebshändler | Produkt | Lagerhaltungsnummer | Lagerbestand | Aktualisiert | Preis |
|---|---|---|---|---|---|
|
INT Xeon-G 6346 CPU for HPE Factory |
6998903 |
Beschreibung
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Spezifikationen
| Prozessor | |
|---|---|
| Processor generation | Skalierbare Intel® Xeon® der 3. Generation |
| Processor base frequency | 2,1 GHz |
| Prozessorhersteller | Intel |
| Cooler included | Nein |
| Prozessorfamilie | Intel® Xeon® Gold |
| Anzahl der Prozessorkerne | 24 |
| Prozessorsockel | LGA 4189 |
| Component for | Server/Arbeitsstation |
| Prozessor Lithografie | 10 nm |
| Box | Nein |
| Processor series | Intel Xeon Gold 5000 Series |
| Prozessor | 5318N |
| Prozessor-Threads | 48 |
| System-Bus | 11,2 GT/s |
| Processor operating modes | 64-Bit |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 36 MB |
| Processor codename | Ice Lake |
| Max. Turbo-Taktfrequenz des Prozessor | 3,4 GHz |
| Speicher | |
| Memory types supported by processor | DDR4-SDRAM |
| Speicherkanäle | Okta-Kanal |
| ECC | Ja |
| Grafik | |
| Discrete graphics card | Nein |
| On-board graphics adapter | Nein |
| On-board Grafik Modell | Nicht verfügbar |
| Dediziertes Grafikmodell | Nicht verfügbar |
| Energiemanagement | |
| Thermal Design Power (TDP) | 150 W |
| Features | |
| Execute Disable Bit | Ja |
| Maximum number of PCI Express lanes | 64 |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 150 W |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Processor package size | 77.5 x 56.5 mm |
| Scalability | 2S |
| Embedded options available | Ja |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Prozessor Besonderheiten | |
| Intel® Turbo-Boost-Technologie | 2.0 |
| Intel Trusted Execution Technology | Ja |
| Intel Hyper-Threading Technology | Ja |
| Intel AES New Instructions | Ja |
| Intel® Speed Shift Technology | Ja |
| Intel VT-x with Extended Page Tables (EPT) | Ja |
| Intel Virtualization Technology for Directed I/O (VT-d) | Ja |
| Intel Virtualization Technology (VT-x) | Ja |
| Intel Software Guard Extensions (Intel SGX) | Ja |
| Intel 64 | Ja |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Ja |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Ja |
| Intel® Optane™ DC Persistent Memory Supported | Ja |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Ja |
| Mode-based Execute Control (MBE) | Ja |
| Intel® Run Sure Technology | Ja |
| Intel® Resource Director Technology (Intel® RDT) | Ja |
| Intel® Transactional Synchronization Extensions | Ja |
| Intel® Total Memory Encryption | Ja |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Ja |
| Intel® Crypto Acceleration | Ja |
| Betriebsbedingungen | |
| Tcase | 83 °C |
| Technical details | |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Number of UPI links | 3 |
| Memory speed (max) | 2667 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Gewicht u. Abmessungen | |
| Processor package size | 77.5 x 56.5 mm |
| Weitere Spezifikationen | |
| Maximaler Hauptspeicher | 6 TB |