HPE ML350p Gen8 Intel Xeon E5-2609v2 4C 2.5GHz Prozessor 2,5 GHz 10 MB L3
- Marke: HPE
- Kategorie:
- Lagerhaltungsnummer: 722284-B21
- EAN: 4514953605350 0798721580665 88 ...1580665 8877582382402 0887758238240mehr
HPE ML350p Gen8 Intel Xeon E5-2609v2 4C 2.5GHz, Intel® Xeon® E5-v2-Prozessoren, LGA 2011 (Socket R), 22 nm, E5-2609V2, 2,5 GHz, 64-Bit
Offer details
Handelspreise
| Vertriebshändler | Produkt | Lagerhaltungsnummer | Lagerbestand | Aktualisiert | Preis |
|---|---|---|---|---|---|
|
HP ML350p Gen8 Intel Xeon E5-2609v2 Processor kit | 722284-B21 |
Beschreibung
HPE ML350p Gen8 Intel Xeon E5-2609v2 4C 2.5GHz. Prozessorfamilie: Intel® Xeon® E5-v2-Prozessoren, Prozessorsockel: LGA 2011 (Socket R), Prozessor Lithografie: 22 nm. Speicherkanäle: Vierfach-Kanal, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel Virtualization Technologie: VT-d, VT-x
Spezifikationen
| Prozessor | |
|---|---|
| Processor base frequency | 2,5 GHz |
| Prozessorfamilie | Intel® Xeon® E5-v2-Prozessoren |
| Anzahl der Prozessorkerne | 4 |
| Prozessorsockel | LGA 2011 (Socket R) |
| Component for | Server/Arbeitsstation |
| Prozessor Lithografie | 22 nm |
| Prozessor | E5-2609V2 |
| Prozessor-Threads | 4 |
| System-Bus | 6,4 GT/s |
| Memory bandwidth supported by processor (max) | 42,6 GB/s |
| Processor operating modes | 64-Bit |
| Thermal Design Power (TDP) | 80 W |
| Processor cache type | L3 |
| Processor cache | 10 MB |
| VID Spannungsbereich | 0,6 - 1,30 V |
| Max. Turbo-Taktfrequenz des Prozessor | 2,5 GHz |
| Number of QPI links | 2 |
| Bus type | QPI |
| Speicher | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 800,1066,1333 MHz |
| Memory bandwidth supported by processor (max) | 42,6 GB/s |
| Speicherkanäle | Vierfach-Kanal |
| ECC | Ja |
| Grafik | |
| On-board graphics adapter | Nein |
| Energiemanagement | |
| Thermal Design Power (TDP) | 80 W |
| VID Spannungsbereich | 0,6 - 1,30 V |
| Features | |
| Thermal Monitoring Technologies | Ja |
| Idle States | Ja |
| Execute Disable Bit | Ja |
| Maximum number of PCI Express lanes | 40 |
| PCI Express slots version | 3.0 |
| Thermal Design Power (TDP) | 80 W |
| Supported instruction sets | AVX |
| Scalability | 2S |
| Physical Address Extension (PAE) | Ja |
| Embedded options available | Ja |
| Market segment | Server |
| Prozessor Besonderheiten | |
| Intel® Turbo-Boost-Technologie | Nein |
| Intel Trusted Execution Technology | Ja |
| Intel Identity Protection Technology | Nein |
| Intel Hyper-Threading Technology | Nein |
| Intel Flex Memory Access | Nein |
| Intel AES New Instructions | Ja |
| Enhanced Intel SpeedStep Technologie | Ja |
| Intel VT-x with Extended Page Tables (EPT) | Ja |
| Intel Virtualization Technology for Directed I/O (VT-d) | Ja |
| Intel Virtualization Technology (VT-x) | Ja |
| Intel® Secure Key | Ja |
| Intel Demand Based Switching | Ja |
| Intel® vPro™ Platform Eligibility | Ja |
| Betriebsbedingungen | |
| Tcase | 71 °C |
| Technische Details | |
| Market segment | Server |
| Weitere Spezifikationen | |
| Intel Virtualization Technologie | VT-d, VT-x |